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Thermal properties of new bismaleimide resins containing hydrogen silsesquioxane and diallyl bisphenol A
Author(s) -
Huang Fuwei,
Huang Farong,
Zhou Yan,
Du Lei
Publication year - 2010
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.32209
Subject(s) - bisphenol a , silsesquioxane , curing (chemistry) , glass transition , materials science , polymer chemistry , hydrogen silsesquioxane , fourier transform infrared spectroscopy , bisphenol , thermal stability , composite material , chemical engineering , chemistry , polymer , organic chemistry , epoxy , resist , layer (electronics) , electron beam lithography , engineering
Bismaleimide (BMI) resins modified with hydrogen silsesquioxane (HSQ) and diallyl bisphenol A (DABPA) (BMI‐HSQ‐DABPA resins) were prepared. DSC, FTIR, and TGA were used to characterize the curing behaviors, structures, and thermal properties of the BMI‐HSQ‐DABPA resins, respectively. The results showed that the glass transition temperatures and thermal stabilities of the cured BMI‐HSQ‐DABPA resins increased with the rise of the contents of HSQ. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010