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Surface functionalization of polypropylene nonwovens by metallic deposition
Author(s) -
Tao Dan,
Feng Quan,
Gao Dawei,
Pan Liang,
Wei Qufu,
Wang Dejuan
Publication year - 2010
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.32067
Subject(s) - polypropylene , copper , materials science , scanning electron microscope , surface modification , x ray photoelectron spectroscopy , fiber , metal , deposition (geology) , chemical engineering , adhesion , composite material , polymer chemistry , metallurgy , paleontology , sediment , engineering , biology
In this study, melt‐blown polypropylene (PP) nonwovens were used as substrates for the metallic deposition of copper. The substrates were pretreated by O 2 plasma, followed by treatments such as sensitization, activation, and reduction. The effects of the copper sulfate concentration, reaction temperature, and plasma power on the conductivity and adhesion strength of the PP nonwovens were investigated after copper deposition. The morphology of the PP nonwovens after copper deposition, analyzed by scanning electron microscopy and atomic force microscopy, revealed that copper nanoclusters were deposited on the fiber surface with a smooth surface morphology and dense structure. X‐ray photoelectron spectroscopy indicated that the copper was present mainly in the form of the elementary substance, which coexisted with a little Cu 2+ . © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010