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Preparation and properties of glass cloth‐reinforced polyimide composites with improved impact toughness for microelectronics packaging substrates
Author(s) -
Xu HongYan,
Yang HaiXia,
Tao LiMing,
Fan Lin,
Yang ShiYong
Publication year - 2010
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.31914
Subject(s) - materials science , polyimide , composite material , thermosetting polymer , flexural strength , thermal stability , toughness , curing (chemistry) , flexural modulus , condensation polymer , dielectric , compression molding , polymer , chemical engineering , mold , optoelectronics , layer (electronics) , engineering
A series of glass cloth‐reinforced thermosetting polyimide composites (EG/HTPI) were prepared from E‐glass cloth (EG) and polyimide matrix resins. The polyimide resins were derived from 1,4‐bis(4‐amino‐2‐ trifluoromethyl‐phenoxy)benzene, p ‐phenylenediamine, diethyl ester of 3,3′,4,4′‐benzophenonetetracarboxylic acid, and monoethyl ester of cis‐5‐norbornene‐endo‐2,3‐dicarboxylic acid. Based on the rheological properties of the B‐staged polyimide resins, the optimized molding cycles were designed to fabricate the EG/HTPI laminates and the copper‐clad laminates (Cu/EG/HTPI). Experimental results indicated that the EG/HTPI composites exhibited high thermal stability and outstanding mechanical properties. They had flexural strength of >534 MPa, flexural modulus of >20.0 GPa, and impact toughness of >46.9 kJ/m 2 . The EG/HTPI composites also showed good electrical and dielectric properties. Moreover, the EG/HTPI laminates exhibited peel strength of ∼ 1.2 N/mm and great isothermal stability at 288°C for 60 min, showing good potential for application in high density packaging substrates. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010