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Study on properties of a novel photosensitive polysiloxane urethane acrylate for solder mask
Author(s) -
Sun Fang,
Jiang Shengling
Publication year - 2010
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.31847
Subject(s) - materials science , acrylate , composite material , soldering , polymer science , polymer chemistry , copolymer , polymer
The photosensitive and physical and mechanical properties of a novel polysiloxane urethane acrylate (PSUA) for solder mask were investigated using real‐time FTIR, DMTA and TGA. It is noted that PSUA showed a notable photosensitivity and a good compatibility with the acrylic monomers and resins. PSUA cured film exhibited excellent thermal property, tensile strength and toughness, and chemical resistance. The decomposition temperature of PSUA was 402 °C. Thermal weight losses of pure PSUA cured film at 300 °C were only 5%. Elongation percentage of PSUA cured film was up to 59%. PSUA resin can be used for solder mask materials for printed circuit. Technology performances of photosensitive imaging flexible solder mask containing PSUA answers operating requirements of the solder masker for printing circuit board. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010