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Development of epoxy‐matrix composite with both high‐thermal conductivity and low‐dielectric constant via hybrid filler systems
Author(s) -
Yung K. C.,
Zhu B. L.,
Yue T. M.,
Xie C. S.
Publication year - 2009
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.31594
Subject(s) - materials science , composite material , epoxy , thermal conductivity , dielectric , boron nitride , composite number , glass transition , thermal expansion , volume fraction , polymer , filler (materials) , dielectric loss , optoelectronics
Materials used for printed circuit boards (PCBs) need to have more multifunctional properties, such as excellent thermal, electrical, and mechanical properties at the same time. Up to now, a sole polymer or single filler‐filled polymer composites is hard to satisfy the demand for more multifunctional properties, especially to obtain high‐thermal conductivity and low‐dielectric constant ( D k ) simultaneously. In this study, two hybrid filler systems [i.e., hollow glass microsphere (HGM) and aluminum nitride (AlN), HGM, and boron nitride (BN)] were filled into epoxy matrix in an attempt to reach a composite with high‐thermal conductivity and low D k at the same time. By varying the size, shape, and volume fraction of hybrid fillers, a new kind of epoxy‐matrix composite both with high‐thermal conductivity and low D k as well as high‐glass transition temperature ( T g ) and low coefficient of thermal expansion (CTE) and dielectric loss factor ( D f ) were developed as candidate for future PCB markets. In addition, multiphase models describing the thermal conductivity and D k were developed, and suitable models were recommended for present materials system. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010