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Thermal pressure coefficient of a polyhedral oligomeric silsesquioxane (POSS)‐reinforced epoxy resin
Author(s) -
Win K. Z.,
Karim Taskin,
Li Qingxiu,
Simon Sindee L.,
McKenna Gregory B.
Publication year - 2009
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.31502
Subject(s) - silsesquioxane , epoxy , materials science , thermal expansion , composite material , glass transition , polymer , thermal , composite number , nanocomposite , polymer chemistry , thermodynamics , physics
The thermal pressure coefficients of a neat, unfilled, epoxy resin and a 10 wt % POSS (polyhedral oligomeric silsesquioxane)‐filled epoxy nanocomposite have been measured using a thick‐walled tube method. It is found that just below the glass transition temperature the thermal pressure coefficient is ∼ 20% smaller for the polymer composite containing 10% POSS than for the neat, unfilled resin. The thermal expansion coefficient and thermal pressure coefficient of the uncured POSS itself are also reported. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010