Thermal pressure coefficient of a polyhedral oligomeric silsesquioxane (POSS)‐reinforced epoxy resin | Zendy

Win K. Z. | Zendy; Karim Taskin | Zendy; Li Qingxiu | Zendy; Simon Sindee L. | Zendy; McKenna Gregory B. | Zendy

AI Assistant Blog Pricing

Home ZAIA Blog

Premium

Thermal pressure coefficient of a polyhedral oligomeric silsesquioxane (POSS)‐reinforced epoxy resin

Author(s) -

Win K. Z.,

Karim Taskin,

Li Qingxiu,

Simon Sindee L.,

McKenna Gregory B.

Publication year - 2009

Publication title -

journal of applied polymer science

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.575

H-Index - 166

eISSN - 1097-4628

pISSN - 0021-8995

DOI - 10.1002/app.31502

Subject(s) - silsesquioxane , epoxy , materials science , thermal expansion , composite material , glass transition , polymer , thermal , composite number , nanocomposite , polymer chemistry , thermodynamics , physics

The thermal pressure coefficients of a neat, unfilled, epoxy resin and a 10 wt % POSS (polyhedral oligomeric silsesquioxane)‐filled epoxy nanocomposite have been measured using a thick‐walled tube method. It is found that just below the glass transition temperature the thermal pressure coefficient is ∼ 20% smaller for the polymer composite containing 10% POSS than for the neat, unfilled resin. The thermal expansion coefficient and thermal pressure coefficient of the uncured POSS itself are also reported. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010

This content is not available in your region!

Continue researching here.

Having issues? You can contact us here

Accelerating Research