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Polyamide 6 composites reinforced with silicon nitride whiskers: Synthesis, interface interaction, and mechanical properties
Author(s) -
Li Lanjie,
Yang Guisheng
Publication year - 2009
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.30708
Subject(s) - materials science , polyamide , composite material , whisker , flexural strength , ultimate tensile strength , composite number , fourier transform infrared spectroscopy , whiskers , flexural modulus , young's modulus , silicon nitride , chemical engineering , layer (electronics) , engineering
In this study, polyamide 6 (PA6)/silicon nitride whisker (SNW) composites were fabricated via in situ hydrolytic ring‐opening polymerization of ε‐caprolactam. By this novel method, SNWs can be dispersed uniformly in PA6 matrix. The interface interaction between SNW and PA6 was investigated, and the reinforcing efficiency of SNW on PA6 was evaluated. It was revealed by Fourier transform infrared spectroscopy that a large amount of polar groups, such as SiOH, NH, and NH 2 , were present on the SNWs, by which hydrogen bonding and covalent bonding can be formed at interface. Mechanical test showed that at a loading of 5.0 wt % SNW, the tensile strength, tensile modulus, flexural strength, flexural modulus, and impact strength of PA6/SNW composite were 37.9, 80.5, 60.3, 73.9, and 64% higher than those of neat PA6, respectively. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010