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Noncatalytic curing of an epoxy siloxane monomer with 1,2,4‐cyclohexanetricarboxylic anhydride: Properties and light‐emitting diode encapsulation
Author(s) -
Morita Yasumasa
Publication year - 2009
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.30692
Subject(s) - siloxane , thermal stability , curing (chemistry) , monomer , glass transition , epoxy , materials science , polymer chemistry , chemistry , composite material , organic chemistry , polymer
Abstract The noncatalytic anhydride curing of an epoxy siloxane monomer, 1,3‐bis[2‐(3‐{7‐oxabicyclo[4.1.0]heptyl})ethyl]tetramethyldisiloxane, with 1,2,4‐cyclohexanetricarboxylic anhydride (H‐TMAn) and methyl hexahydrophthalic anhydride (MeHHPA) was studied. Different H‐TMAn concentrations, ranging from 13 to 58 mol %, were evaluated. The highest curing exotherm and highest glass‐transition temperature were both found at 50 mol %. MeHHPA showed a sharp dependence of the thermal stability and thermal discoloration on the anhydride concentration. In contrast, the H‐TMAn concentration did not much affect the thermal stability or thermal discoloration. H‐TMAn could be diluted up to 3 times with MeHHPA to reduce the initial viscosity without a loss of noncatalytic reactivity. Unlike MeHHPA, H‐TMAn experienced very little anhydride evaporation and weight reduction. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009