Premium
Novel low‐dielectric‐constant copolyimide thin films composed with SiO 2 hollow spheres
Author(s) -
Yuan Yuan,
Lin BaoPing,
Sun Yueming
Publication year - 2010
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.30467
Subject(s) - materials science , polyimide , dielectric , thermogravimetric analysis , phthalic anhydride , glass transition , thermal decomposition , thin film , scanning electron microscope , composite material , polymer chemistry , composite number , fluorene , chemical engineering , analytical chemistry (journal) , polymer , organic chemistry , nanotechnology , chemistry , optoelectronics , layer (electronics) , engineering , catalysis
A series of copolyimide/SiO 2 hollow sphere thin films were prepared successfully based on bis[3,5‐dimethyl‐4‐(4‐aminophenoxy)phenyl]methane and 9,9‐bis(4‐(4‐aminophenoxy)phenyl)fluorene (molar ratio = 3 : 1) as diamine, and 4,4′‐(4,4′‐isopropylidenediphenoxy)bis(phthalic anhydride) as dianhydride, with different wt % SiO 2 hollow sphere powder with particle size 500 nm. Some films possessed excellent dielectric properties, with ultralow dielectric constants of 1.8 at 1 MHz. The structures and properties of the thin films were measured with Fourier transform infrared spectra, scanning electron microscope, thermogravimetric analysis, and dynamic mechanical thermal analysis. The polyimide (PI) films exhibited glass‐transition temperatures in the range of 209– 273°C and possessed initial thermal decomposition temperature reaching up to 413–477°C in air and 418–472°C in nitrogen. Meanwhile, the composite films were also exhibited good mechanical properties. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011