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Synthesis and characterization of a novel silicon‐containing polytriazole resin
Author(s) -
Huang Jianxiang,
Wan Liqiang,
Zhang Jian,
Gao Fei,
Tian Jianjun,
Huang Farong,
Du Lei
Publication year - 2009
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.30433
Subject(s) - differential scanning calorimetry , materials science , glass transition , curing (chemistry) , composite material , fourier transform infrared spectroscopy , silicon , polymerization , thermosetting polymer , polymer chemistry , polymer , chemical engineering , physics , engineering , metallurgy , thermodynamics
4,4′‐Diazidomethylbiphenyl (DAMBP) and poly(dimethylsilylene‐ethynylenephenyleneethynylene) (PDMSEPE) were thermally polymerized to form a novel silicon‐containing polytriazole resin (PDMSEPE‐DAMBP) by 1,3‐dipolar cycloaddition. Differential scanning calorimetry, FTIR, and 13 C‐NMR were used to characterize the curing behaviors of PDMSEPE‐DAMBP resins. The results indicated that the resins could cure at temperatures as low as 80°C. Dynamic mechanical analysis showed that there was a glass transition at 302°C for the cured PDMSEPE‐DAMBP resin. The carbon fiber (T700) reinforced PDMSEPE‐DAMBP composites exhibited excellent mechanical properties at room temperature and high property retention at 250°C. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009