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Oxygen barrier coating deposited by novel plasma‐enhanced chemical vapor deposition
Author(s) -
Jiang Juan,
Benter Maike,
Taboryski Rafael,
Bechgaard Klaus
Publication year - 2009
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.30222
Subject(s) - materials science , polyethylene terephthalate , chemical vapor deposition , coating , diffusion barrier , barrier layer , plasma , layer (electronics) , polyethylene , plasma enhanced chemical vapor deposition , electrode , chemical engineering , deposition (geology) , composite material , plasma processing , oxygen , dielectric barrier discharge , nanotechnology , chemistry , organic chemistry , optoelectronics , dielectric , paleontology , physics , quantum mechanics , sediment , engineering , biology
We report the use of a novel plasma‐enhanced chemical vapor deposition chamber with coaxial electrode geometry for the SiO x deposition. This novel plasma setup exploits the diffusion of electrons through the inner most electrode to the interior samples space as the major energy source. This configuration enables a gentle treatment of sensitive materials like low‐density polyethylene foils and biodegradable materials. SiO x coatings deposited in the novel setup were compared with other state of the art plasma coatings and were found to possess equally good or better barrier properties. The barrier effect of single‐layer coatings deposited under different reaction conditions was studied. The coating thickness and the carbon content in the coatings were found to be the critical parameters for the barrier property. The novel barrier coating was applied on different polymeric materials, and it increased the barrier property of the modified low‐density polyethylene, polyethylene terephthalate, and polylactide by 96.48%, 99.69%, and 99.25%, respectively. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010