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Preparation and properties of one epoxy system bearing fluorene moieties
Author(s) -
Liu Wenbin,
Qiu Qihao,
Wang Jun,
Huo Zichun,
Sun He,
Zhao Xiuxia
Publication year - 2009
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.30141
Subject(s) - epoxy , thermogravimetric analysis , diglycidyl ether , fluorene , thermal stability , differential scanning calorimetry , materials science , glass transition , bisphenol a , curing (chemistry) , polymer chemistry , fourier transform infrared spectroscopy , epoxide , composite material , polymer , chemical engineering , organic chemistry , chemistry , thermodynamics , physics , catalysis , engineering
Diglycidyl ether of bisphenol fluorene (DGEBF) and 9,9‐bis(4‐aminophenyl) fluorene (BPF) were synthesized to introduce more aromatic structures into an epoxy system, and their chemical structures were characterized with Fourier transform infrared spectroscopy, NMR, and mass spectrometric analysis. The dynamic curing behavior of the DGEBF/BPF system was investigated with differential scanning calorimetry. DGEBF was cured with BPF, diaminodiphenylsulfone (DDS), and diaminodiphenylmethane (DDM), and E‐44 (bisphenol A epoxide) was also cured with BPF for comparison. The thermal properties of the obtained polymers were evaluated with dynamic mechanical thermal analysis and thermogravimetric analysis. The cured DGEBF/BPF system showed a remarkably higher glass‐transition temperature, better thermal stability and lower moisture absorption in comparison with the general bisphenol A epoxy resin/BPF system but approximated the heat resistance of the DGEBF/DDS and DGEBF/DDM systems. Such properties make this epoxy system very promising for heat‐resistant applications. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009