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Cure kinetics of ternary blends of epoxy resins studied by nonisothermal DSC data
Author(s) -
Tripathi Garima,
Srivastava Deepak
Publication year - 2009
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.29781
Subject(s) - diglycidyl ether , epoxy , materials science , differential scanning calorimetry , curing (chemistry) , autocatalysis , kinetics , bisphenol a , ternary operation , acrylonitrile , polymer chemistry , copolymer , composite material , thermodynamics , polymer , physics , quantum mechanics , computer science , programming language
The curing kinetics of blends of diglycidyl ether of bisphenol A (DGEBA), cycloaliphatic epoxy resins, and carboxyl‐terminated butadiene‐acrylonitrile random copolymer (CTBN) in presence of 4,4′‐diamino diphenyl sulfone (DDS) as the curing agent was studied by nonisothermal differential scanning calorimetry (DSC) technique at different heating rates. The kinetic parameters of the curing process were determined by isoconversional method given by Malek for the kinetic analysis of the data obtained by the thermal treatment. A two‐parameter ( m , n ) autocatalytic model (Sestak‐Berggren equation) was found to be the most adequate selected to describe the cure kinetics of the studied epoxy resins. The values of E a were found to be 88.6 kJ mol −1 and 61.6 kJ mol −1 , respectively, for the studied two sample series. Nonisothermal DSC curves obtained using the experimental data show a good agreement with that theoretically calculated. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009