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Characterization of bagasse‐rind particleboard bonded with chitosan
Author(s) -
Umemura Kenji,
Kaiho Keiji,
Kawai Shuichi
Publication year - 2009
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.29704
Subject(s) - bagasse , chitosan , acetic acid , adhesive , materials science , steam explosion , pressing , flexural strength , swelling , nuclear chemistry , composite material , chemical engineering , chemistry , pulp and paper industry , organic chemistry , layer (electronics) , engineering
The development of high‐performance non‐wood lignocellulosic board without using synthetic adhesives derived from fossils resources is very important for the future. In this study, the characterization of bagasse particleboard bonded with chitosan was investigated. The 4 wt % chitosan‐acetic acid solution was sprayed onto bagasse rind particles at a 2–10 wt % chitosan solid content based on the dry particles. Particleboards with target densities of 0.75 and 0.9 g/cm 3 were manufactured using a steam‐injection press. The steam pressure and total pressing time were 1 MPa (180°C) and 7 min, respectively. The addition of 2–4 wt % of chitosan was the most effective in the bending properties. The high‐density board bonded with a 4 wt % addition of chitosan showed a good result in the internal bond strength test. Furthermore, the board had favorable dimensional stability in dilute acetic acid as well as in a cyclic accelerated aging test. Judging from the analysis of bagasse extract‐added chitosan films, it was suggested that chitosan reacted with extract from bagasse during steam‐injection pressing. The reaction seemed to contribute to the board's good resistance to dilute acid. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009