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Thermal, dielectric, and mechanical properties of SiC particles filled linear low‐density polyethylene composites
Author(s) -
Zhou Wenying,
Yu Demei,
Min Chao,
Fu Yinping,
Guo Xiusheng
Publication year - 2009
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.29602
Subject(s) - linear low density polyethylene , materials science , composite material , crystallinity , composite number , dielectric , polyethylene , differential scanning calorimetry , thermal stability , silicon carbide , high density polyethylene , chemical engineering , physics , optoelectronics , engineering , thermodynamics
A thermally conductive linear low‐density polyethylene (LLDPE) composite with silicon carbide (SiC) as filler was prepared in a heat press molding. The SiC particles distributions were found to be rather uniform in matrix at both low and high filler content due to a powder mixing process employed. Differential scanning calorimeter results indicated that the SiC filler decreases the degree of crystallinity of LLDPE, and has no obvious influence on the melting temperature of LLDPE. Experimental results demonstrated that the LLDPE composites displays a high thermal conductivity of 1.48 Wm −1 K −1 and improved thermal stability at 55 wt % SiC content as compared to pure LLDPE. The surface treatment of SiC particles has a beneficial effect on improving the thermal conductivity. The dielectric constant and loss increased with SiC content, however, they still remained at relatively low levels (<10 2 Hz); whereas, the composites showed poorer mechanical properties as compared to pure LLDPE. In addition, combined use of small amount of alumina short fiber and SiC gave rise to improved overall properties of LLDPE composites. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009