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Synthesis and characterization of the two novel liquid crystalline epoxy resins based on bisphenol‐s mesogen
Author(s) -
Huo Li,
Gao Jungang,
Du Yonggang,
Chai Zhihua
Publication year - 2008
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.28973
Subject(s) - mesogen , mesophase , differential scanning calorimetry , materials science , liquid crystal , thermotropic crystal , epoxy , diglycidyl ether , polymer chemistry , curing (chemistry) , melting point , fourier transform infrared spectroscopy , glass transition , bisphenol a , polymer , composite material , chemical engineering , liquid crystalline , physics , optoelectronics , thermodynamics , engineering
Two novel liquid crystalline epoxy resins (LCER) based on bisphenol‐S mesogen, 4,4′‐Bis‐(2,3‐epoxypropyloxy)‐sulfonyl bis(1,4‐phenylene) ( p ‐BEPSBP) and sulfonyl bis(4,1‐phenylene) bis[4‐(2,3‐epoxypropyloxy)benzoate] ( p ‐SBPEPB), were synthesized. Their liquid crystalline behavior and structure were characterized by Fourier transmittance infrared ray (FTIR), differential scanning calorimetry (DSC), 1 HNMR, polarized optical microscopy (POM) and X‐ray diffraction (XRD). The results show that p ‐BEPSBP is a kind of thermotropic liquid crystal and has a smectic mesophase with a melting point ( T m ) at 165°C; the p ‐SBPEPB is a kind of nematic mesophase with the temperature range of 155–302°C from the T m to the clearing point T i . The curing behaviors and texture of the liquid crystalline epoxy resins with 4,4′‐diaminodiphenyl ether (DDE) were also studied by DSC and some kinetic parameters were evaluated according to the Ozawa's method. The dynamic mechanical properties of curing products were also investigated by torsional braid analysis (TBA), and the results suggest that the dynamic mechanical loss peak temperature ( T p ) of p ‐BEPSBP/DDE and p ‐SBPEPB/DDE is 120 and 130°C, respectively. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008