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Synthesis and FTIR spectroscopic investigation of the UV curing kinetics of telechelic urethane methacrylate crosslinkers based on the renewable resource—Cardanol
Author(s) -
Rekha N.,
Asha S. K.
Publication year - 2008
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.28342
Subject(s) - cardanol , methacrylate , fourier transform infrared spectroscopy , isophorone diisocyanate , polymer chemistry , curing (chemistry) , materials science , prepolymer , polymerization , hydrogen bond , double bond , chemical engineering , chemistry , polyurethane , organic chemistry , polymer , molecule , composite material , epoxy , engineering
UV curable telechelic urethane–methacrylate crosslinkers based on the natural resource—cardanol was synthesized in a one pot synthetic step involving end capping of isophorone diisocyanate with one equivalent of hydroxyethyl methacrylate followed by condensation with cardanol. The structures of the resins were characterized by 1 H and 13 C NMR, fourier transform infrared (FTIR) and Matrix‐assisted laser desorption/ionization time of flight (MALDI‐TOF) spectroscopies and size exclusion chromatography (SEC). The curing process and double bond conversion in presence of 2,2‐diethoxy acetophenone as photoinitiator upon UV irradiation was followed by Fourier transform infrared spectroscopy. These hydrogen bonded crosslinkers based on cardanol and its derivatives had higher double bond conversion when compared to a nonhydrogen bonding standard such as hexanediol diacrylate (HDDA) under identical conditions. The temperature effects on the hydrogen bonding were investigated, and a decrease in the extent of double bond conversion with increase in temperature was observed for the telechelic urethane–methacrylate crosslinkers whereas a steady increase in the curing rate was observed for HDDA. This gives direct indication of the influence of hydrogen bonding on the curing process. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008