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Development and electrical conductivity behavior of copper‐powder‐filled‐epoxy graded composites
Author(s) -
Chand Navin,
Nigrawal Archana
Publication year - 2008
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.28267
Subject(s) - epoxy , electrometer , materials science , composite material , copper , conductivity , activation energy , electrical resistivity and conductivity , arrhenius equation , thermal conduction , composite number , metallurgy , chemistry , electrical engineering , organic chemistry , engineering
This article reports the development and direct‐current (dc) conductivity behavior of copper‐powder‐filled‐epoxy graded composite. Copper‐powder‐filled‐epoxy composites with 10 wt % copper powder and epoxy resin were developed. dc conductivity measurements were performed on the graded composites with an electrometer in the temperature range of 28–146°C. The dc conductivity decreased with an increase in the distance in the direction of the centrifugal force, and this showed the formation of a graded structure. The dc conductivity increased as the copper powder content increased. Two‐phase conduction occurred in all the copper‐filled‐epoxy graded samples. The activation energy calculated with an Arrhenius equation for one sample was 0.88 eV, and this was mainly due to conduction electronic. Another sample had an activation energy of 1.33 eV. Three samples exhibited ionic conduction. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008