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Synthesis and properties of silicon‐containing bismaleimide resins
Author(s) -
Tang Haoyu,
Song Naiheng,
Chen Xiaofang,
Fan Xinghe,
Zhou Qifeng
Publication year - 2008
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.28042
Subject(s) - dimethylsilane , differential scanning calorimetry , materials science , monomer , polymer chemistry , thermogravimetric analysis , diamine , polymerization , glass transition , thermal stability , polymer , composite material , chemistry , organic chemistry , physics , thermodynamics
Two novel bismaleimide (BMI) monomers containing silicon atom in the structure, i.e., bis[4‐(4‐maleimidophenylcarbonyloxy)phenyl]dimethylsilane (BMI‐SiE1) and bis[4‐(4‐maleimidophenyloxycarbonyl)phenyl]dimethylsilane (BMI‐SiE2), were designed, synthesized, and polymerized with and without the use of diamine as comonomers to yield novel silicon‐containing BMI resins. Both monomers obtained are readily soluble in organic solvents, such as chloroform and N , N ‐dimethylformamide. Differential scanning calorimetry and thermogravimetric analysis investigation of these two monomers indicated a high polymerization temperature ( T p > 240°C) and a good thermal and thermo‐oxidative stability of cured BMI resins. The onset temperature for 5% weight loss was found to be above 450°C in nitrogen and above 400°C in the air. Polymerization of BMI‐SiE1 and BMI‐SiE2 with 4,4′‐diaminodiphenylether (DPE) yielded a series of polyaspartimides that had good solubility and could be thermally cured at 250°C. TGA investigations of the cured diamine‐modified BMI resins showed onset of degradation temperatures ( T d s) in the range of 344–360°C in nitrogen and 332–360°C in the air. Composites based on the cured diamine‐modified BMI resins and glass cloth were prepared and characterized for their dynamic mechanical properties. All the composites showed high glass transition temperatures (e.g., >190°C) and high bending modulus in the range of 1000–2700 MPa. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008