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UV/heat dual‐curable adhesive tapes for fabricating stacked packages of semiconductors
Author(s) -
Saiki Naoya,
Yamazaki Osamu,
Ebe Kazuyoshi
Publication year - 2008
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.27663
Subject(s) - tmpta , adhesive , materials science , curing (chemistry) , trimethylolpropane , monomer , composite material , acrylic resin , uv curing , acrylate , epoxy , acrylate polymer , polymer chemistry , acrylic acid , fabrication , polymer , layer (electronics) , coating , medicine , alternative medicine , pathology , polyurethane
Abstract To facilitate the fabrication of a reliable stacked package for a semiconductor, UV/heat dual curing of adhesives was investigated. The formulated adhesives contained acrylic monomer and epoxy resins. First, UV curing was conducted on the acrylic monomer, followed by heat curing. It was found that UV‐curable acrylic monomers affected the adhesive's properties, e.g., adhesion, water absorption, and viscoelasticity. As the acrylic monomer, neopentylglycol diacrylate (NPGDA), trimethylolpropane triacrylate (TMPTA), dipentaerythritol hexaacrylate (DPHA), and tricyclodecanedimethanol acrylate (TCDDA) were used to investigate the effect of functional group numbers and structure. As a result, an acrylic monomer that has two functional groups with a rigid moiety (TCDDA) showed acceptable properties as adhesives for the fabrication, and thus a UV/heat‐curing adhesive has been successfully developed. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008