Premium
A formaldehyde‐free flame retardant wood particleboard system based on two‐component polyurethane adhesive
Author(s) -
Tang Yong,
Wang DeYi,
Jing XinKe,
Ge XinGuo,
Yang Bing,
Wang YuZhong
Publication year - 2008
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.27662
Subject(s) - fire retardant , limiting oxygen index , adhesive , char , materials science , polyurethane , flammability , formaldehyde , composite material , thermal decomposition , thermogravimetric analysis , urea formaldehyde , pyrolysis , chemistry , organic chemistry , layer (electronics)
To address the problem of formaldehyde‐free flame retardation of wood particleboard, a novel phosphorus‐containing compound, di(2,2‐dimethyl‐1,3‐propanediol phosphate) urea (DDPPU) was synthesized. DDPPU was used as flame retardant for wood particleboard. The flammability of treated wood particleboard systems consisted of wood particles, polyurethane (PU) adhesive, and different flame retardant formulations were investigated by limiting oxygen index (LOI). The results of LOI indicate that DDPPU could improve the flame retardancy of wood particleboard. However, when H 3 BO 3 was used as the second flame retardant component and combined with DDPPU, the flame retardant wood particleboard could obtain the highest LOI value (46.0) in these experiments. Thermogravimetric analysis shows that treated wood particleboard can decrease the initial decomposition temperature, and that at higher temperatures the degradation rate are lower than the untreated wood particleboard. Furthermore, wood particleboard treated with DDPPU/H 3 BO 3 has a higher yield of residue char at 600°C than that treated with other flame retardant systems. The ability of char formation of these samples agrees with the order of LOI values. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008