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Preparation and characterization of polyimide/Al 2 O 3 hybrid films by sol–gel process
Author(s) -
Ma Pengchang,
Nie Wei,
Yang Zhenghua,
Zhang Peihong,
Li Gang,
Lei Qingquan,
Gao Lianxun,
Ji Xiangling,
Ding Mengxian
Publication year - 2008
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.27540
Subject(s) - polyimide , pyromellitic dianhydride , materials science , thermal stability , sol gel , elongation , monomer , dielectric , hybrid material , aluminium , chemical engineering , composite material , polymer chemistry , polymer , ultimate tensile strength , nanotechnology , layer (electronics) , optoelectronics , engineering
A sol–gel process has been developed to prepare polyimide (PI)/Al 2 O 3 hybrid films with different contents of Al 2 O 3 based on pyromellitic dianhydride (PMDA) and 4,4′‐oxydianiline (ODA) as monomers. FESEM and TEM images indicated that Al 2 O 3 particles are relatively well dispersed in the polyimide matrix after ultrasonic treatment of the sol from aluminum isopropoxide and thermal imidization of the gel film. The dimensional stability, thermal stability, mechanical properties of hybrid PI films were improved obviously by an addition of adequate Al 2 O 3 content, whereas, dielectric property and the elongation at break decreased with the increase of Al 2 O 3 content. Surprisingly, the corona‐resistance property of hybrid film was improved greatly with increasing Al 2 O 3 content within certain range as compared with pure PI film. Especially, the hybrid film with 15 wt % of Al 2 O 3 content exhibited obviously enhanced corona‐resistance property, which was explained by the formation of compact Al 2 O 3 network in hybrid film. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008