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Study of cure kinetics of diglycidyl ether of bisphenol A with Ni(II) and Cu(II) complexes of benzil bisthiosemicarbazone
Author(s) -
Ghaemy Mousa,
Behmadi Hossein,
Barghamadi Mohammad
Publication year - 2007
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.26902
Subject(s) - diglycidyl ether , curing (chemistry) , epoxy , differential scanning calorimetry , benzil , activation energy , kinetics , polymer chemistry , bisphenol a , materials science , ether , order of reaction , metal , chemistry , reaction rate constant , composite material , organic chemistry , catalysis , thermodynamics , quantum mechanics , metallurgy , physics
The curing reaction kinetics of the diglycidyl ether of bisphenol A (DGEBA)‐based epoxy and inorganic complexes curing agents based on Ni(II) and Cu(II) chelates with benzil bisthiosemicarbazone LH 6 as a ligand was studied using differential scanning calorimetry (DSC). The curing reaction with the ligand and the complexes was characterized by high cure onset and peak maximum temperatures. The kinetics of the curing reaction was evaluated using three kinetic models; Kissinger, Ozawa‐Flynn‐Wall, and Málek. For the NiLH 4 and CuLH 4 the average values of E a were calculated to be 82.3 and 116 kJ/mol, respectively. For both complexes, their activation energies at 40 and 30 phr are equal. The values of activation energy ( E a ), and initial and maximum temperatures of the exothermic curing peak ( T i and T p ) of the ligand are smaller than those of the complexes, and the values of these parameters of the DGEBA/NiLH 4 system are lower than those of DGEBA/CuLH 4 system. These results indicate the order of reactivity of LH 6 ≫ NiLH 4 ≫ CuLH 4 toward epoxy resin. The effect of hardener concentration, heating rate, and type of metal ion on the cure kinetic parameters and the shape of DSC thermograms were investigated. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007