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Morphology, dynamic mechanical properties, and gas separation of crosslinking silica‐containing polyimide nanocomposite thin film
Author(s) -
Tsai MeiHui,
Huang ShihLiang,
Chiang PeiChun,
Chen ChiouJuy
Publication year - 2007
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.26830
Subject(s) - polyimide , materials science , nanocomposite , selectivity , monomer , imide , glass transition , polymer chemistry , ether , relaxation (psychology) , thin film , polymer , chemical engineering , composite material , nanotechnology , chemistry , organic chemistry , layer (electronics) , catalysis , psychology , social psychology , engineering
Silica‐containing polyimide (PI‐Si) crosslinked hybrid films are synthesized and applied to gas separation application. The PI‐Si hybrid films are prepared from 4,4′‐diaminodiphenyl ether (ODA), 3, 3′‐oxydiphthalic anhydride (ODPA), p ‐aminophenyltrimethoxysilane (APTS), and phenyltrimetoxysilane (PTS). The monomer of monoamide APTS is used to modulate the block chain length of ODA–ODPA and then form bonding between PTS and ODA–ODPA phases. In the series of x ASPI (where x indicates the molecular weight (in kg/mol) of PI block chain length of ODA–ODPA and ASPI denotes PI modified with APTS) hybrid films, the glass transition temperature ( T g ) increases and α‐relaxation damping peak intensity decreases with the increase of APTS content. Meanwhile, the gas permeabilities of O 2 and N 2 of x ASPI films are slightly higher as compared with pure PI. The other series of (5AS– y ‐S)PI (5ASPI incorporates with PTS and y is the weight of PTS) hybrid films, the properties of T g , density, and α‐relaxation damping peak intensity are decreased with increasing the PTS content. However, higher O 2 and N 2 gas permeabilities and O 2 /N 2 selectivity are achieved by increasing the PTS content in (5AS– y ‐S)PI hybrid films. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007

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