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Preparation, curing kinetics, and thermal properties of bisphenol fluorene epoxy resin
Author(s) -
Dai Zhen,
Li Yanfang,
Yang Shuguang,
Zong Chengzhong,
Lu Xukui,
Xu Jian
Publication year - 2007
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.26585
Subject(s) - diglycidyl ether , epoxy , thermogravimetric analysis , differential scanning calorimetry , curing (chemistry) , materials science , bisphenol a , glass transition , fluorene , polymer chemistry , fourier transform infrared spectroscopy , char , kinetics , composite material , thermosetting polymer , ether , chemical engineering , polymer , chemistry , organic chemistry , pyrolysis , thermodynamics , physics , quantum mechanics , engineering
Diglycidyl ether of 9,9‐bis(4‐hydroxyphenyl) fluorene (DGEBF) was synthesized to introduce more aromatic structures into an epoxy resin system. The structure of DGEBF was characterized with Fourier transform infrared and 1 H‐NMR. 4,4′‐Diaminodiphenylmethane (DDM) was used as the curing agent for DGEBF, and differential scanning calorimetry was applied to study the curing kinetics. The glass‐transition temperature of the cured DGEBF/DDM, determined by dynamic mechanical analysis, was 260°C, which was about 100°C higher than that of widely used diglycidyl ether of bisphenol A (DGEBA). Thermogravimetric analysis was used to study the thermal degradation behavior of the cured DGEBF/DDM system: its onset degradation temperature was 370°C, and at 700°C, its char yield was about 27%, whereas that of cured DGEBA/DDM was only 14%. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007