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Dielectric and thermal properties of polymer network based on bismaleimide resin and cyanate ester containing dicyclopentadiene or dipentene. III
Author(s) -
Hwang HannJang,
Shieh JengYueh,
Li ChunHung,
Wang ChunShan
Publication year - 2006
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.24951
Subject(s) - dicyclopentadiene , cyanate ester , materials science , thermal stability , glass transition , thermogravimetric analysis , dielectric , composite material , dissipation factor , dynamic mechanical analysis , thermosetting polymer , bisphenol a , polymer chemistry , polymer , polymerization , chemistry , organic chemistry , epoxy , optoelectronics
A series of bismaleimide‐triazine (BT) resins were prepared from commercial bismaleimide (DDMBMI) and 2,6‐dimethylphenol‐dicyclopentadiene dicyanate ester (DCPDCY) or 2,6‐dimethylphenol‐dipentene dicyanate ester (DPCY). The thermal properties of cured BT resins containing DCPD or DP were studied using a dielectric analyzer (DEA), dynamic mechanical analyzer (DMA), and thermal gravimetric analyzer (TGA). These data were compared with that of DDMBMI cured with bisphenol A dicyanate ester (BADCY). The cured DDMBMI/DCPDCY or DDMBMI/DPCY exhibits a lower dielectric constant, dissipation factor, and moisture absorption than those of DDMBMI/BADCY. The effects of blend composition on the glass transition temperatures and thermal stability are discussed. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 1942–1951, 2007