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Cure kinetics of aqueous phenol‐formaldehyde resins used for oriented strandboard manufacturing: Effect of wood flour
Author(s) -
Lei Yong,
Wu Qinglin
Publication year - 2006
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.24739
Subject(s) - curing (chemistry) , formaldehyde , order of reaction , differential scanning calorimetry , autocatalysis , materials science , kinetics , condensation polymer , adhesive , activation energy , composite material , polymer chemistry , chemistry , organic chemistry , polymer , catalysis , reaction rate constant , physics , layer (electronics) , quantum mechanics , thermodynamics
The effect of wood flour on the cure kinetics of commercial phenol‐formaldehyde resins used as oriented strandboard face and core adhesives was studied using differential scanning calorimetry. The wood flour did not change the cure mechanism of the face resin, but lowered its cure temperature and activation energy and increased its cure reaction order. For the core resin (CR), the wood flour lowered the onset cure temperature, and caused separation of the addition and condensation reactions involved in curing of CR. Compared with neat CR, the addition reaction of CR/wood mixture also followed an n th‐order reaction mechanism but with a lower reaction order, while the condensation was changed from an autocatalytic reaction to an n th‐order one. The addition reaction happened at temperatures lower than 90°C, and the condensation reaction was dominant at temperatures higher than 110°C. The proposed models fitted the experimental data well. Relationships among cure reaction conversion (cure degree), cure temperature, and cure time were predicted. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102:3774–3781, 2006