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Influence of the network structure and void content on hygrothermal stability of resol resin modified with epoxy–amine
Author(s) -
Manfredi Liliana B.,
Fraga Alicia N.,
Vázquez Analía
Publication year - 2006
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.24323
Subject(s) - epoxy , materials science , thermogravimetric analysis , thermal stability , composite material , void (composites) , absorption of water , amine gas treating , diffusion , interpenetrating polymer network , chemical engineering , polymer chemistry , polymer , organic chemistry , chemistry , physics , engineering , thermodynamics
Epoxy–amine was blended with two resol resins to study the influence of the final network and void content on the water absorption of these systems. To characterize the network structure of the blends, infrared analyses were performed. It was observed that a diminution in the crosslink density of the network and the reaction between the epoxy and resol have been occurred. From dynamic–mechanical analyses, a diminution in the T g value and an increment in the height of the tan δ peak with the epoxy–amine content added to the resol were observed. Thermogravimetric analysis showed that the thermal stability of the resol was reduced by the addition of epoxy–amine as well as a lesser crosslink network for the blends with higher epoxy–amine content. The maximum water uptake and the diffusion coefficient were related with the chemical structure and void content of the specimens. On one hand, the maximum water uptake was observed to depend on the void content of the blends. On the other hand, the diffusion coefficient appears to be related with the local motions of the polymeric chains and with the hydrophilic character of the materials. This behavior was observed for the two resols studied. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 588–597, 2006