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Enhancing thermal conductivity and physical properties of phenol‐formaldehyde resin by adding VGCF during pyrolysis
Author(s) -
Ko TseHao,
Hu HsienLin,
Kuo WenShyong,
Wang SuHow
Publication year - 2006
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.23753
Subject(s) - materials science , pyrolysis , flexural strength , composite material , phenol , phenol formaldehyde resin , formaldehyde , shrinkage , thermal conductivity , carbon fibers , chemical engineering , organic chemistry , chemistry , composite number , engineering
After vapor‐grown carbon‐fibers (VGCF) were added to resol‐type phenolic resin, their influence on microstructure, thermal conductivity, flexural strength, and physical properties of the resin was characterized in this work. Resin with content 0–10 wt % VGCF was heat‐treated at 230–2500°C. As a result, it was observed that adding VGCF into resin during pyrolysis not only reduced weight loss but also limited shrinkage of resin. Moreover, adding VGCF to resin promoted the degree of arranging carbon basal planes and chemical densification of the structure of final heat‐treated resins. At 2500°C, the graphitized resin with 10 wt % VGCF enhanced flexural strength and thermal conductivity over 300%, while decreasing weight loss around 20% versus graphitized phenol‐formaldehyde resin developed from the original resin. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 1531–1538, 2006