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Polyesterimide resins with built‐in polycyclic compounds
Author(s) -
Wardzińska Elżbieta,
Penczek Piotr
Publication year - 2006
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.23244
Subject(s) - thermal stability , bisphenol a , thermal decomposition , polymer chemistry , condensation polymer , ethylene glycol , materials science , decomposition , bisphenol , solubility , glass transition , condensation , fire retardant , chemical engineering , succinic anhydride , trimellitic anhydride , chemistry , organic chemistry , polymer , composite material , epoxy , physics , thermodynamics , engineering
Abstract Polyesterimide (PEI) resins are used for the preparation of PEI varnishes, for copper wire enameling. They are usually manufactured from dimethyl terephthalate (DMT), ethylene glycol, bisphenol A (BPA), tris(2‐hydroxyethyl) isocyanurate, trimellitic anhydride, and 4,4′‐diaminodiphenylmethane. The synthesis involves condensation and imidization. DMT and BPA were partially or completely replaced with the polycyclic components: dimethyl 2,6‐naphthalenedicarboxylate (NDC) and ( R , S )‐1,1‐bis(4‐hydroxyphenyl)‐3,3,5‐trimethylcyclohexane (TMC), respectively, to enhance the heat resistance and the thermal stability. The effect of NDC and TMC on the solubility, the glass transition temperature, the course of the thermal decomposition, and the properties of magnet wires, enameled with the thus‐modified PEI varnishes, were investigated. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 4066–4073, 2006