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Conductive epoxy/amine system containing polyaniline doped with dodecylbenzenesulfonic acid
Author(s) -
Moreira Viviane X.,
Garcia Filiberto G.,
Soares Bluma G.
Publication year - 2006
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.23238
Subject(s) - triethylenetetramine , diglycidyl ether , epoxy , polyaniline , materials science , curing (chemistry) , differential scanning calorimetry , glass transition , polymer chemistry , bisphenol a , composite material , amine gas treating , stoichiometry , polymer , chemistry , organic chemistry , polymerization , physics , thermodynamics
We developed a conductive epoxy/amine system containing polyaniline doped with dodecylbenzenesulfonic acid (PAni.DBSA). The curing behaviors of diglycidyl ether of bisphenol A with triethylenetetramine (TETA), PAni.DBSA, and both amine compounds at different concentrations were investigated by differential scanning calorimetry (DSC). Epoxy/TETA systems containing PAni.DBSA presented two distinct exothermic peaks at 90°C due to the cure by TETA as a hardener and at 236°C related to PAni.DBSA as the curing agent. The presence of PAni.DBSA in the systems constituted by epoxy/hardener in stoichiometric proportions resulted in a decrease in the glass‐transition temperature of the epoxy matrix, as indicated by DSC and dielectric analyses. Electrical conductivity was determined in the epoxy/amine networks, with the TETA concentration kept constant and also in stoichiometric proportions of mixed hardener (TETA + PAni.DBSA) to epoxy resin. The last condition resulted in a higher electrical conductivity. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100:4059–4065, 2006
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