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Fluorinated‐plasma modification of polyetherimide films
Author(s) -
Kaba Meriyam,
Essamri Azzouz,
Mas Andre,
Schue Francois,
George G. A.,
Cardona F.,
Rintoul L.,
Wood B. J.
Publication year - 2006
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.22930
Subject(s) - polyetherimide , x ray photoelectron spectroscopy , materials science , plasma , scanning electron microscope , surface modification , fourier transform infrared spectroscopy , surface energy , layer (electronics) , plasma polymerization , polymer , analytical chemistry (journal) , contact angle , coating , polymerization , polymer chemistry , chemical engineering , chemistry , composite material , organic chemistry , physics , quantum mechanics , engineering
Ultem 1000 polyetherimide films prepared by cast‐evaporating technique were covered with a 1 H ,1 H ,2 H ‐tridecafluoro‐oct‐1‐ene (PFO) plasma‐polymerized layer. The effects of the plasma exposure time on the surface composition were studied by X‐ray photoelectron spectroscopy, Fourier transform infrared spectroscopy, and surface energy analysis. The surface topography of the plasma layer was deduced from scanning electron microscopy. The F/C ratio for plasma‐polymerized PFO under the input RF power of 50 W can be as high as 1.30 for 480 s and ∼0.4–2 at % of oxygen was detected, resulting from the reaction of long‐lived radicals in the plasma polymer with atmospheric oxygen. The plasma deposition of fluorocarbon coating from plasma PFO reduces the surface energy from 46 to 18.3 mJ m −2 . © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 3579–3588, 2006