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Preparation and properties of polyimide/silica hybrid composites based on polymer‐modified colloidal silica
Author(s) -
Im JiSun,
Lee JuHyung,
An SeungKook,
Song KiWon,
Jo NamJu,
Lee JangOo,
Yoshinaga Kohji
Publication year - 2006
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.22896
Subject(s) - polyimide , materials science , bpda , glass transition , scanning electron microscope , polymer , composite number , thermal stability , composite material , colloid , ether , polymer chemistry , chemical engineering , layer (electronics) , organic chemistry , chemistry , engineering
Abstract A new type of polyimide/silica (PI/SiO 2 ) hybrid composite films was prepared by blending polymer‐modified colloidal silica with the semiflexible polyimide. Polyimide was solution‐imidized at higher temperature than the glass transition temperature ( T g ) using 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA) and 4,4′‐diaminodiphenyl ether (ODA). The morphological observation on the prepared hybrid films by scanning electron microscopy (SEM) pointed to the existence of miscible organic–inorganic phase, which resulted in improved mechanical properties compared with pure PI. The incorporation of the silica structures in the PI matrix also increased both T g and thermal stability of the resulting films. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 2053–2061, 2006