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Preparation and thermal properties of resole‐type phenol resin–clay nanocomposites
Author(s) -
Kato Makoto,
Tsukigase Azusa,
Usuki Arimitsu,
Shimo Toshihisa,
Yazawa Hidemi
Publication year - 2006
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.22850
Subject(s) - nanocomposite , phenol , compounding , materials science , silicate , chemical engineering , penetration (warfare) , composite material , chemistry , organic chemistry , operations research , engineering
Resole‐type phenol resin–clay nanocomposites have been prepared successfully by melt compounding phenol resin with organophilic clay. In the resulting phenol resin–clay nanocomposite, the silicate layers of the clay were exfoliated and dispersed as monolayers. The nanocomposite exhibited higher long‐term heat resistance when compared with unmodified phenol resin. It was surmised that the silicate layers of the clay acted as barriers to oxygen penetration into the resin, as the degree of heat degradation of the nanocomposite was much lower than that of the straight phenol resin. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 99: 3236–3240, 2006