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A chelating cellulose adsorbent for the removal of Cu(II) from aqueous solutions
Author(s) -
O'Connell D. W.,
Birkinshaw C.,
O'Dwyer T. F.
Publication year - 2005
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.22568
Subject(s) - cellulose , adsorption , aqueous solution , glycidyl methacrylate , polymer chemistry , thermogravimetric analysis , langmuir adsorption model , regenerated cellulose , imidazole , nuclear chemistry , chemistry , materials science , monomer , organic chemistry , polymer
Regenerated cellulose wood pulp was grafted with the vinyl monomer glycidyl methacrylate (GMA) using ceric ammonium nitrate as initiator and was further fuctionalised with imidazole to produce a novel adsorbent material, cellulose‐ g ‐GMA‐imidazole. All cellulose, grafted cellulose and functionalized cellulose grafts were physically and chemically characterized using a number of analytical techniques, including elemental analysis, Fourier transform infrared spectroscopy, thermogravimetric analysis, differential thermal analysis, and scanning electron microscopy. The cellulose‐ g ‐GMA material was found to contain 1.75 mmol g −1 epoxy groups. These epoxy groups permitted introduction of metal binding functionality to produce the cellulose‐ g ‐GMA‐imidazole final product. Following characterization, a series of adsorption studies were carried out on the cellulose‐ g ‐GMA‐imidazole to assess its capacity in the removal of Cu 2+ ions from solution. Cellulose‐ g ‐GMA‐imidazole sorbent showed an uptake of ∼70 mg g −1 of copper from aqueous solution. The adsorption process is best described by the Langmuir model of adsorption, and the thermodynamics of the process suggest that the binding process is mildly exothermic. The kinetics of the adsorption process indicated that copper uptake occurred within 30 min and that pseudo‐second‐order kinetics best describe the overall process. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 2006