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Microstructure and properties of new polyimide/polysiloxane composite films
Author(s) -
Lü Changli,
Wang Zhen,
Liu Feng,
Yan Jingling,
Gao Lianxun
Publication year - 2006
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.22532
Subject(s) - polyimide , materials science , composite number , microstructure , ultimate tensile strength , thermal stability , composite material , amorphous solid , chemical engineering , polymer chemistry , organic chemistry , layer (electronics) , chemistry , engineering
Abstract A series of novel polyimide/polydiphenylsiloxane) (PI/PDDS) composite films with different contents of DDS were prepared using sol–gel method. The noncrosslinked PI–DDS and crosslinked PIS–DDS were synthesized through cohydrolysis and condensation between DDS and polyamic acid (PAA) or aminopropyltriethoxysilane(APTES)‐terminated polyamic acid (PAAS). All the composite films have high thermal stability near pure PI. Field emission scanning electron microscopy (FE‐SEM) study shows that the polysiloxane from hydrolyzed DDS well dispersed in polyimide matrix, without macroscopic separation for the composite films with low content of DDS, while large domain of polysiloxane was formed in films with high DDS content. The microstructure of composite films is in accordance with the transparency of corresponding films. X‐ray study shows the PDDS is amorphous in PI matrix. The introduction of DDS into PI can improve the elongation at break and at the same time, the composite films still remained with higher modulus and tensile strength. The density and water absorption of the composite films decreased with the increasing DDS content. The composite films with DDS content below 10 wt % exhibit good solvent resistance. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 124–132, 2006