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Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering
Author(s) -
Li Yi,
Moon KyoungSik,
Wong C. P.
Publication year - 2005
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.22509
Subject(s) - sintering , materials science , soldering , composite material , contact resistance , adhesive , joint (building) , electrical conductor , electrical contacts , copper , nano , electrical resistance and conductance , metal , particle (ecology) , metallurgy , layer (electronics) , architectural engineering , oceanography , engineering , geology
The electrical properties of anisotropically conductive adhesives (ACAs) joints through low temperature sintering of nano silver (Ag) particles were investigated and compared with that of the submicron‐sized Ag‐filled ACA and lead‐free solder joints. The nano Ag particles used exhibited sintering behavior at significantly lower temperatures (<200°C) than at the bulk Ag melting temperature (960°C). The sintered nano Ag particles significantly reduced the joint resistance and enhanced the current carrying capability of ACA joints. The improved electrical performance of ACA was attributed to the reduced interfaces between the Ag particles and the increased interfacial contact area between nano Ag particles and bond pads by the particle sintering. The reduced joint resistance was comparable to that of the lead‐free (tin/3.5 silver/0.5 copper) metal solder joints. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 99: 1665–1673, 2006