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Curing behavior of 4,4′‐diamonodiphenyl methane‐based benzoxazine oligomers/bisoxazoline copolymers and the properties of their cured resins
Author(s) -
Li Shengfang,
Wang Luoli
Publication year - 2005
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.22310
Subject(s) - curing (chemistry) , materials science , isopropyl , polymer chemistry , copolymer , bisphenol a , bisphenol , oligomer , polymer , ether , organic chemistry , chemistry , epoxy , composite material
Abstract 1,3‐Phenylene bisoxazoline is synthesized and characterized. The optimal synthetic conditions for yield (92%) are as follows: reaction temperature = 115°C; ratio (mol) of ethanolamine to 1,3‐dicyanobenzene = 2.5 : 1; ratio (mol) of zinc acetate to 1,3‐dicyanobenzene = 0.055; reaction time = 6 h. 4,4′‐diamonodiphenyl methane‐based benzoxazine and its oligomers (Oligo‐Da) are synthesized and characterized. The curing behavior and properties of the Oligo‐Da/1,3‐PBO copolymer resins are investigated. It was found that the cure induction time and cure time of the molten mixture from Oligo‐Da/1,3‐PBO could be reduced, compared with that from Oligo‐Ba/1,3‐PBO, especially above 175°C. The reason lies in that the bisphenol generated in ring opening of Ba has more steric hindrance than the phenol generated in ring opening of Da because of isopropyl group. Thus, the Mannich bridge structure in the Da polymer is relatively much easier to form between the ortho positions of phenolic hydroxyl groups than that in the Ba polymer. Curing temperature of Oligo‐Da/1,3‐PBO could be lowered with triphenylphosphite as a catalyst. SEM results confirm that 1,3‐PBO could toughen Oligo‐Da system when the mol ratio of 1,3‐PBO and Oligo‐Da is ≤1 because of the formation of ether–amide bonds. However, a brittle fracture surface is observed because of too higher crosslinking density of the cured resin, when the mol ratio of 1,3‐PBO and Oligo‐Da is >1. The cured resin from Oligo‐Da/1,3‐PBO has superior heat resistance, electrical insulation, and water resistance than that from Oligo‐Ba/1,3‐PBO. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 99: 1359–1366, 2006