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Thermal analysis of novel underfill materials with optimum processing characteristics
Author(s) -
Liu Yang,
Wang YiFeng,
Gerasimov Timofey G.,
Heffner Kenneth H.,
Harmon Julie P.
Publication year - 2005
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.22272
Subject(s) - materials science , differential scanning calorimetry , thermogravimetric analysis , composite material , scanning electron microscope , ceramic , thermomechanical analysis , oligomer , boron nitride , dynamic mechanical analysis , thermal analysis , polymer , polymer chemistry , chemical engineering , thermal , thermal expansion , physics , engineering , thermodynamics , meteorology
This work encompasses the development of low‐viscosity cyclic oligomer underfill formulations that cure without heat evolution. Boron nitride, silica‐coated aluminum nitride, and alumina ceramic powders were used as fillers in cyclic butylene terephthalate oligomer melts. The melts were heated with a suitable catalyst to induce polymerization. The effects of the filler type and composition on the thermal and mechanical properties of the poly(butylene terephthalate)/filler composites were examined with differential scanning calorimetry, temperature‐modulated differential scanning calorimetry, thermogravimetric analysis, thermomechanical analysis, and dynamic mechanical analysis. Scanning electron microscopy was employed to elucidate the morphology of these composites. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 98: 1300–1307, 2005