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Micro‐void toughening of thermosets and its mechanism
Author(s) -
Kim Nam Ho,
Kim Ho Sung
Publication year - 2005
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.22262
Subject(s) - epoxy , toughening , void (composites) , materials science , thermosetting polymer , composite material , scanning electron microscope , toughness , electron microscope , optics , physics
Void toughening is studied using epoxy resin. Voids were produced mechanically without any chemical agents so that it was possible to isolate the role of micro‐voids from other factors. Toughness of the epoxy resin owing to voids was improved over that of the control by an order of magnitude. The toughening mechanism was found to be strongly related to intervoid distance and, hence, to void‐to‐crack distance. Large deformation bands between the crack and voids were deduced to be the source of toughening. The intervoid distance was directly measured on scanning electron microscope photos. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 98: 1290–1295, 2005