z-logo
Premium
Adhesion of microwave‐plasma‐treated fluoropolymers to thermoset vinylester
Author(s) -
Hedenqvist M. S.,
Merveille A.,
Odelius K.,
Albertsson A.C.,
Bergman G.
Publication year - 2005
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.22174
Subject(s) - fluoropolymer , materials science , thermosetting polymer , contact angle , composite material , tetrafluoroethylene , surface energy , adhesion , x ray photoelectron spectroscopy , scanning electron microscope , epoxy , polymer , plasma , copolymer , polymer chemistry , chemical engineering , physics , quantum mechanics , engineering
Poly(tetrafluoroethylene) and a fluoroethylene copolymer were surface treated with a 2.45‐GHz microwave plasma to enhance their adhesion to a vinylester thermoset. The plasmas were generated with an inert gas (Ar) and with reactive gases (H 2 , O 2 , and N 2 ). The lap‐joint shear stress was measured on fluoropolymer samples glued with the vinylester. In general, the stress at failure increased with increasing plasma‐energy dose. The H 2 plasma yielded the best adhesion, and X‐ray photoelectron spectroscopy revealed that it yielded the highest degree of defluorination of the fluoropolymer surface. The defluorination efficiency declined in the order H 2 , Ar, O 2 , and N 2 . Contact angle measurements and scanning electron microscopy revealed that the surface roughness of the fluoropolymer depended on the rate of achieving the target energy dose. High power led to a smoother surface, probably because of a greater increase in temperature and partial melting. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 98: 838–842, 2005

This content is not available in your region!

Continue researching here.

Having issues? You can contact us here
Accelerating Research

Address

John Eccles House
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom