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Adhesion of microwave‐plasma‐treated fluoropolymers to thermoset vinylester
Author(s) -
Hedenqvist M. S.,
Merveille A.,
Odelius K.,
Albertsson A.C.,
Bergman G.
Publication year - 2005
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.22174
Subject(s) - fluoropolymer , materials science , thermosetting polymer , contact angle , composite material , tetrafluoroethylene , surface energy , adhesion , x ray photoelectron spectroscopy , scanning electron microscope , epoxy , polymer , plasma , copolymer , polymer chemistry , chemical engineering , physics , quantum mechanics , engineering
Poly(tetrafluoroethylene) and a fluoroethylene copolymer were surface treated with a 2.45‐GHz microwave plasma to enhance their adhesion to a vinylester thermoset. The plasmas were generated with an inert gas (Ar) and with reactive gases (H 2 , O 2 , and N 2 ). The lap‐joint shear stress was measured on fluoropolymer samples glued with the vinylester. In general, the stress at failure increased with increasing plasma‐energy dose. The H 2 plasma yielded the best adhesion, and X‐ray photoelectron spectroscopy revealed that it yielded the highest degree of defluorination of the fluoropolymer surface. The defluorination efficiency declined in the order H 2 , Ar, O 2 , and N 2 . Contact angle measurements and scanning electron microscopy revealed that the surface roughness of the fluoropolymer depended on the rate of achieving the target energy dose. High power led to a smoother surface, probably because of a greater increase in temperature and partial melting. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 98: 838–842, 2005