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Novel rapid‐cure adhesives for low temperature using thiirane compound
Author(s) -
Chino Keisuke,
Suga Kazuo,
Ikawa Masahiro,
Satoh Hajime
Publication year - 2001
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.2151
Subject(s) - thiirane , bisphenol a , curing (chemistry) , epoxy , adhesive , bisphenol , materials science , composite material , polymer chemistry , chemistry , organic chemistry , ring (chemistry) , layer (electronics)
We investigated improvement of workability (viscosity), storage stability, and curing ability of thiirane resin for adhesive applications. The viscosity of bisphenol‐F thiirane resin was lower than that of bisphenol‐A thiirane resin, especially at low temperatures, thus improving ease of handling. Addition of diphenyl decyl phosphite improved its storage stability to a level similar to that of bisphenol‐A epoxy resin. The curing of bisphenol‐F thiirane resin increased three times faster by adding 2,4,6‐tris(dimethylaminomethyl)phenol (DMP‐30) as a tertiary amine. In applications of this new thiirane resin as civil and architectural adhesives, a superior curing ability at low temperature was attained. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 2953–2957, 2001