Premium
Synthesis and practicability of novel additives for copper electroplating with semiconductor packaging
Author(s) -
Sugimoto Masaharu,
Yamaguchi Kazuki,
Kouzai Hiroaki,
Honma Hideo
Publication year - 2005
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.21490
Subject(s) - copper , copper plating , materials science , electroplating , plating (geology) , miniaturization , peg ratio , ethylene glycol , electrical conductor , galvanic cell , chemical engineering , electronics , nanotechnology , polymer chemistry , composite material , chemistry , metallurgy , finance , layer (electronics) , geophysics , geology , economics , engineering
Connection reliability between Large Scale Integrated circuit (LSI) and electronic devices is increasingly important with the miniaturization of electronic devices. For the formation of fine conductors on wiring in electronic devices, copper electroplating is generally applied and is controlled with various organic additives. In this study, for the purpose of developing additives capable of working on a finer conductive copper circuit, we focused our attention on the synthesis of organic additives with inhibition action for the plating. Generally, poly(ethylene glycol) (PEG) was used as an inhibitor. We synthesized the PEG derivatives, which were α‐(2‐chloroethyl)‐ω‐chloropoly(oxyethylene) (PEG‐Cl) and α‐(2‐sulfoethyl)‐ω‐sulfopoly(oxyethylene)disodium, and evaluated them for their Via‐filling properties. Good filling properties were achieved by the addition of these synthesized materials to a normal copper‐plating bath. Furthermore, with PEG‐Cl, good filling properties were achieved without chlorine ions, which were usually added to the bath. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 837–840, 2005