Premium
Conductive effect of an electronic/ionic complex conductivity modifier for silicone elastomers
Author(s) -
Chiu HsienTang,
Wu JyhHorng
Publication year - 2005
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.20978
Subject(s) - materials science , ionic conductivity , silicone , composite material , elastomer , polymer chemistry , conductivity , polymer , polymer blend , ethylene oxide , chemical engineering , electrolyte , copolymer , chemistry , electrode , engineering
This study examined silicone, which demonstrated an ionic/electronic compounding conductivity effect through the complexation of polypyrrole (Ppy), carbon black (CB), and a poly(propylene oxide)–poly(ethylene oxide) copolymer with 20 wt % LiClO 4 (PEL). Rigid‐body pendulum rheometry was used to observe the processing conditions for the polymer blends, and energy‐dispersive X‐ray spectrometry was used to analyze the distribution depth of the polymer blend surfaces for Ppy. In addition, a digital electrometer was used to test the surface resistance of the composites, and an impedance meter was used to test the dielectric constant and loss factor. The results showed that PEL‐obstructed silicone molecular chain crosslinking, transformed from liquid to solid films, required a higher temperature for curing than silicone because the linear molecular structure of the polymer electrolyte was wound around the silicone polymer network structure, forming a semi‐interpenetrating network. This showed that the Ppy molecule could permeate SP10 blends more deeply. After the silicone was treated with the PEL modifier, the conductivity of Ppy was obstructed. On the other hand, the conductivity of CB showed no significant difference in the SP10 blends. Therefore, after the silicone matrix treatment of the electronic/ionic complex conduction process, there was no incremental effect on the conductivity. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 711–720, 2005