Premium
Bonding properties of epoxy resins containing two mesogenic groups
Author(s) -
Ochi Mitsukazu,
Hori Daisuke,
Watanabe Yutaka,
Takashima Hiroshige,
Harada Miyuki
Publication year - 2004
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.20328
Subject(s) - mesogen , epoxy , materials science , adhesive , composite material , bisphenol a , layer (electronics) , polymer , liquid crystalline
Liquid‐crystalline epoxy resins, with introduced aliphatic chains between two mesogenic groups, were synthesized and their adhesive bonding properties were compared to those of the bisphenol‐A–type epoxy resin and the liquid‐crystalline epoxy resin, previously reported. The bonding strength of the former resin system was higher than that of the two later systems. We suggest that the high bonding strength of the twin mesogenic epoxy resins, cured with an aromatic amine, was attributable to the large plastic deformation of the adhesive layer in the fracturing process. We also investigated the effects of the aliphatic chain length in the twin mesogenic epoxy resin on their dynamic mechanical and bonding properties. The bonding strength of the cured twin mesogenic epoxy resins increased with an increase in the aliphatic chain length. We suggest that the high bonding strength of the system introduced by the long aliphatic chain was attributable to the large plastic deformation of the adhesive layer because of the higher network mobility. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 3721–3729, 2004