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Synthesis and properties of PMR type poly(benzimidazopyrrolone‐imide)s
Author(s) -
Li Y. F.,
Hu A. J.,
Wang X. C.,
Gao S. Q.,
Yang S. Y.
Publication year - 2001
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1999
Subject(s) - differential scanning calorimetry , materials science , glass transition , thermogravimetric analysis , thermosetting polymer , dynamic mechanical analysis , thermal stability , polymer chemistry , imide , curing (chemistry) , condensation polymer , polymer , thermal decomposition , polyimide , norbornene , chemical engineering , monomer , composite material , chemistry , organic chemistry , physics , layer (electronics) , engineering , thermodynamics
PMR type poly(benzimidazopyrrolone‐imide) or poly(pyrrolone‐imide) (PPI) matrix resin was synthesized using the diethyl ester of 4,4′‐(hexafluoroisopropylidene)diphthalic acid (6FDE), 3,3′‐diaminobenzidine, para ‐phenylenediamine, and monoethyl ester of cis ‐5‐norbornene‐endo‐2,3‐dicarboxylic acid (NE) in anhydrous ethyl alcohol with N ‐methylpyrrolidone. The homogeneous matrix resin solution (40–50% solid) was stable for a storage period of 2 weeks and showed good adhesion with carbon fibers, which ensured production of prepregs. The chemical and thermal processes in the polycondensation of the monomeric reactant mixture were monitored by Fourier transform infrared spectroscopy, thermogravimetric analysis, differential scanning calorimetry, scanning electron microscopy, etc. Thermosetting PPI as well as short carbon fiber‐reinforced polymer composites was accomplished at optimal thermal curing conditions. The polymer materials, after postcuring, showed excellent thermal stability, with an initial decomposition temperature > 540°C. Results of MDA experiments indicate that the materials showed > 70–80% retention of the storage modulus at 400°C and glass transition temperatures as high as 440–451°C. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 1600–1608, 2001