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Adhesion promotion at high temperature for epoxy resin or polyimide onto metal by a two‐component coupling system of polybenzimidazole and 4‐aminophenyl disulfide
Author(s) -
Xue Gi,
Wang Yongxia,
Chen Yiyuan,
Tsai Shingsan,
Jiang Lusha
Publication year - 1995
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1995.070581210
Subject(s) - adhesive , polyimide , epoxy , materials science , adhesion , component (thermodynamics) , disulfide bond , coupling (piping) , polymer chemistry , metal , layer (electronics) , composite material , chemistry , metallurgy , biochemistry , physics , thermodynamics
A two‐component coupling agent layer consisting of polybenzimidazole and 4 aminophenyl disulfide showed better anticorrosive performance and higher adhesive strength for copper and resins than did each single component even at high temperature. © 1995 John Wiley & Sons, Inc.