Adhesion promotion at high temperature for epoxy resin or polyimide onto metal by a two‐component coupling system of polybenzimidazole and 4‐aminophenyl disulfide | Zendy

Xue Gi | Zendy; Wang Yongxia | Zendy; Chen Yiyuan | Zendy; Tsai Shingsan | Zendy; Jiang Lusha | Zendy

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Adhesion promotion at high temperature for epoxy resin or polyimide onto metal by a two‐component coupling system of polybenzimidazole and 4‐aminophenyl disulfide

Author(s) -

Xue Gi,

Wang Yongxia,

Chen Yiyuan,

Tsai Shingsan,

Jiang Lusha

Publication year - 1995

Publication title -

journal of applied polymer science

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.575

H-Index - 166

eISSN - 1097-4628

pISSN - 0021-8995

DOI - 10.1002/app.1995.070581210

Subject(s) - adhesive , polyimide , epoxy , materials science , adhesion , component (thermodynamics) , disulfide bond , coupling (piping) , polymer chemistry , metal , layer (electronics) , composite material , chemistry , metallurgy , biochemistry , physics , thermodynamics

A two‐component coupling agent layer consisting of polybenzimidazole and 4 aminophenyl disulfide showed better anticorrosive performance and higher adhesive strength for copper and resins than did each single component even at high temperature. © 1995 John Wiley & Sons, Inc.

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