Effect of coupling agents on thermal and electrical properties of mica/epoxy composites | Zendy

Bajaj Pushpa | Zendy; Jha N. K. | Zendy; Kumar Anand | Zendy

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Effect of coupling agents on thermal and electrical properties of mica/epoxy composites

Author(s) -

Bajaj Pushpa,

Jha N. K.,

Kumar Anand

Publication year - 1995

Publication title -

journal of applied polymer science

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.575

H-Index - 166

eISSN - 1097-4628

pISSN - 0021-8995

DOI - 10.1002/app.1995.070561015

Subject(s) - epoxy , mica , composite material , materials science , thermal expansion , dielectric , composite number , coupling (piping) , optoelectronics

The influence of 3‐aminopropyltriethoxysilane, 3‐glycidyloxypropyltrimethoxysilane, and neoalkoxytric(dioctyl pyrophosphato)zirconate on thermal expansion behavior, dielectric strength, and arc resistance of mica/epoxy composites has been investigated. The addition of mica up to 30% resulted in the reduction of thermal expansion with respect to neat resin. However, the coefficient of linear thermal expansion of 30% mica treated with aminosilane was the least among the various coupling agent‐coated filler/epoxy composites. Mica (30%)/epoxy composites showed the highest dielectric strength values (26 kV/mm), but the highest arc resistance was obtained in zirconate‐treated mica (30%)/epoxy composite. © 1995 John Wiley & Sons, Inc.

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