Premium
Effect of coupling agents on thermal and electrical properties of mica/epoxy composites
Author(s) -
Bajaj Pushpa,
Jha N. K.,
Kumar Anand
Publication year - 1995
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1995.070561015
Subject(s) - epoxy , mica , composite material , materials science , thermal expansion , dielectric , composite number , coupling (piping) , optoelectronics
The influence of 3‐aminopropyltriethoxysilane, 3‐glycidyloxypropyltrimethoxysilane, and neoalkoxytric(dioctyl pyrophosphato)zirconate on thermal expansion behavior, dielectric strength, and arc resistance of mica/epoxy composites has been investigated. The addition of mica up to 30% resulted in the reduction of thermal expansion with respect to neat resin. However, the coefficient of linear thermal expansion of 30% mica treated with aminosilane was the least among the various coupling agent‐coated filler/epoxy composites. Mica (30%)/epoxy composites showed the highest dielectric strength values (26 kV/mm), but the highest arc resistance was obtained in zirconate‐treated mica (30%)/epoxy composite. © 1995 John Wiley & Sons, Inc.