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Effect of process parameters on residual stress distribution in poly(ethylene terephthalate) fibers and films as revealed by chemical etching
Author(s) -
Gupta V. B.,
Radhakrishnan J.,
Sett S. K.
Publication year - 1995
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1995.070550207
Subject(s) - materials science , ethylene , scanning electron microscope , poly ethylene , composite material , residual stress , aqueous solution , methylamine , isotropic etching , aqueous medium , polymer chemistry , etching (microfabrication) , chemical engineering , chemistry , organic chemistry , engineering , catalysis , layer (electronics)
Poly(ethylene terephthalate) fibers and films produced by varying process parameters, such as production speed and medium, temperature and rate of drawing, were annealed at temperatures between 100 and 250°C in the free‐to‐shrink and constant‐length conditions. The as‐spun, as‐drawn, and drawn and annealed samples were etched in 40% aqueous methylamine at room temperature for 4 h. The etch patterns were examined on a scanning electron microscope and were found to be related mainly to residual stress and its distribution in the samples and thereby to sample morphology. The studies clearly bring about the important role played by the processing history. © 1995 John Wiley & Sons, Inc.