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Carbonization of polyimide films: Effect of cold‐drawing and chemical structure
Author(s) -
Takeichi Tsutomu,
Takenoshita Hidehiro,
Ogura Satoshi,
Inagaki Michio
Publication year - 1994
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1994.070540310
Subject(s) - polyimide , pyromellitic dianhydride , bpda , materials science , carbonization , polymer , polymer chemistry , electrical resistivity and conductivity , conductivity , composite material , chemical engineering , chemistry , layer (electronics) , scanning electron microscope , electrical engineering , engineering
Polyimides of various chemical structures were prepared from pyromellitic dianhydride (PMDA), biphenyltetracarboxylic dianhydride (BPDA), oxydianiline (ODA), and p ‐phenylenediamine (PDA). The cold‐drawn polyimide films were prepared and carbonized. The electrical conductivity of the carbonized films enhanced linearly with the draw ratio. The effect of cold‐drawing on the electrical conductivity is more remarkable with the rigid polyimides such as PMDA/PDA and BPDA/PDA than the flexible polyimides such as PMDA/ODA and BPDA/ODA. The tendency is well in accord with the effect of cold drawing on the improvement of modulus of polyimides. With the rigid polyimides, the higher alignment of polymer chain is supposed to be achieved by the cold‐drawing. © 1994 John Wiley & Sons, Inc.